Industry 4.0: Smart Waste Systems

The future of waste collection is modular, smart, and sustainable. With Industry 4.0 and our innovative CMP+ production, we create waste solutions that continuously improve themselves — for cities, businesses, and the planet.

CMP+ is a fully demountable and modular system for underground and above-ground waste containers. Unlike traditional welded constructions, CMP+ offers greater flexibility, faster assembly, and easy maintenance. Components can be replaced or adapted locally without specialized welding — ideal for circular asset management and on-site deployment, including by social enterprises.

Industry 4.0 makes this approach possible. With digital engineering, IoT sensors, and a data-driven workflow, we seamlessly connect design, production, and usage into a single smart ecosystem. Our containers automatically monitor fill levels, feature intelligent access control, and detect malfunctions before they occur. The result: lower operational costs, fewer transport movements, and greater control over field performance.

Industry 4.0 makes this approach possible. Through digital engineering, IoT sensors, and a data-driven workflow, we connect design, production, and usage in one smart ecosystem. Our containers automatically measure fill levels, feature intelligent access control, and detect faults proactively. The result: lower operational costs, fewer transport movements, and greater control over real-world performance.

CMP+ aligns perfectly with the principles of Industry 4.0: connectivity, modularity, scalability, and circularity. With real-time feedback and smart components, our systems keep improving — every single day.

With CMP+, we’re not just building containers — we’re building infrastructure. Waste systems that think with you, adapt to their environment, and are ready for the city of tomorrow.

Helden van Staal Industry 4.0

Curious to see what Helden van Staal can create for your organization?
Get in touch with us at:
+31 (0)229 – 28 47 45 of info@heldenvanstaal.nl.